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Epoxy Glue For PCB Assembly PCB

Epoxy Glue For PCB Assembly PCB

SE3307Production IntroductionOne component epoxy adhesive SE3307 is a kind of heat cured adhesive. It designed for stencil printing . High bonding strength,high humidity-intensity,excellent electrica

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SE3307

Production  Introduction

One component epoxy adhesive SE3307 is a kind of heat cured adhesive. It designed for stencil printing . High bonding strength,high humidity-intensity,excellent electrical performance and good storage stability

Typical Usage

Mainly used for the bonding of the mounted components on SMT.

Properties Uncured

Typical Value       Range                 Test Standard

Appearance                            Red cream Chemical Type                         Epoxy Resin Viscosity (Pa.s) (Brookfield   RV)

Spindle   7                                500-800            GB/T   2794-1995

Thixotropic index                            5.6

Density (g/cm3)                             1.35                1.55-1.65             GB/T   13354-1992

Operate Time at Room Temperature

(day@25℃)                                 14

Curing Condition Recommended

90-120s  at 120℃.

60-90s  at 150℃

The product will obtain to higher bonding strength when higher curing temperature and longer cured time . the figure curve is the recommended curing temperature and heating rate,Under the corresponding temperature ,components need the time when they achieve good bonding strength.

Users can set the curing furnace’s temperature parameters according to the solidified characteristic curve of the glue and the heat efficiency of the Reflow Ovens

Performance After Cured

(Cured for 30min@150℃)


Physical Property

Typical

Value

Test Standard

Hardness(Shore D)

81


GB/T 2411-1980

Shear Strength(MPa)

14.8


GB/T 7124-1986

Tg(℃)(DSC)

98


ASTM  E1545

Dielectric strength(KV/mm)

Surface resistance (Ω)

Heat strength

27.5

3.4×1016


GB/T408.1-1999

GB/T1410-2006

(30min at 150℃)




Shear Strength(MPa)AL-AL




Direction  For  Use

The product should be recovered to room temperature before use, don't open the aluminum foil package before recovered to room temperature(the recovering time of 300ml packaging at least 2-4 hours).

The product should be used at 25℃ , <60% Rh .

The glue viscosity will decline under the higher temperature, which influence printing

effect; High humidity can increase the glue of moisture absorption which shorten the opening hours of the glue and influence the glue bonding strength. This product opening time is

48 hours at 25 ℃,55% Rh.

Suggest to print at the speed of 20-150 mm/s; Drawknife pressure is 3-4 N/cm (Afer scraping, sheet should be clean, and avoid producing wire drawing); the deviating speed from the sheet is 0.1 3.0 mm/s.

Not cured adhesive which is stick on line wires can be erased with acetone or propylene alcohol ethers.

please seal and chill   when not using up the glue.

Notice

Keep away from children.

The workshop should be adequate ventilation. Wash with soapy water if on skin.

Wash with a lot of soapy water and then go for doctor if in eyes.

For more information, please refer to MSDS.

Package

20ml/tube ; 30ml/tube ; 200ml/tube 

Storage

6 months sealed at 2-8℃.


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