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Fast Curing Structural Epoxy Adhesive

High Tensile Fast Curing Epoxy Adhesive SE2211◆Detailed Product DescriptionSE2211 is epoxy adhesive with high tensile and high curing speedFeatures1.Resistance of moisture, pollution and other atmosph

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High Tensile Fast Curing Epoxy Adhesive SE2211

◆Detailed Product Description

SE2211 is epoxy adhesive with high tensile and high curing speed


1.Resistance of moisture, pollution and other atmospheric constituent 

2.High tensile, excellent adhesive property

3.Excellent pollution resistance, the demand of preprocess is low

4.No solvent, no curing by-products

5.Wonderful anti-temperature (-50℃~150℃)

6.Excellent adhesive performance with fiberglass and metal sheet

7.Have passed the UL certification 


For SMC FRP bonding, aluminum honeycomb pane splicing, transformer motor core bonding, Nomex paper bonding etc.

◆Data Table

Properties before curin





Black thick paste

Off-white thick paste

Density,  g/cm3(25℃)



Mixture/mass ratio, weight


Mixture/mass ratio, volume


Viscosity after mixing, mPa.s (25℃)


Density after mixing,  g/cm3(25℃)


Operation time after mixing, min(25℃)


Preliminary curing time,℃/min

60/20 or 25/70

Properties after curing

Hardness, Shore D


Tensile-shear strength Mpa ,Al/Al


Heat conductivity, W/mK


Expansion parameterμm/(m,℃)


Water absorption 24h,25℃,%


Dielectric strength, KV/mm,25℃


Loss factor(1 MHz)


Dielectric constant (1 MHz)


Volume resistance DC500V, Ω·cm



①All data above were tested under standardized condition.

②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.

③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing


1. Buckets of A and B material is recommended to be stirred before using the components of A/B ,  A, B should be paid attention to seal preservation after using .

2.Stirring should pay attention to the same direction, otherwise there will be mixed with too many air bubbles; Container frame and bottom of the rubber should also stir evenly,  otherwise there will be a local not curing phenomenon caused by the mixing inequality  

3.The temperature is too low will cause the curing speed slow, when unable to reach initial strength , constant temperature control required on site.

4.Cartridge packaging use midway need to keep the material mouth sealed.

5.This curing process of adhesive is exothermic reaction , the adhesive quantity will affect the duration of operation, thus the operating time with 100 g adhesive is only a reference time.

◆Package and Storage

Package                                                       Storage

Part A : 20kg/bucket , 310ml/cartridge         Seal and Avoid light and light

Part B: 20kg/bucket or 310ml/cartridge       Temperature≤25℃, humidity≤50%RH

Customized packaging                                 Shelf life: Part A 12months, Part B 12 months

◆Safety Operation Material

MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center, or call +86-400-882-1323.

◆Product Warranty

All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replace or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.

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