Two Component Silicone Potting Compound For Electronics SI2225 ◆Detailed Product DescriptionFeatures1.SI 2225A/B is used for encapsulating and potting varied electronic components. It can vulcanize to
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Two Component Silicone Potting Compound For Electronics SI2225
◆Detailed Product Description
1.SI 2225A/B is used for encapsulating and potting varied electronic components. It can vulcanize to deep layer. The two components have a good fluidity after mixing. You can adjust the proportion of curing agent while operating. It’s primerless and bonding well with most materials. It can be used to fix the accessories and resist water, dust and leakage current.
2.Double component high clarity liquid silicone adhesive, condensation dealcoholization.
3.Low viscosity, easy to process and operate.
4.Low hardening condensation, no corrosion and unstressing.
5.Excellent insulativity and stability in high temperature.
6.Excellent bonding, good water-proof and moisture-proof.
1.Electronic and modules of automobile potting.
2.Power control module potting .
3.LED display screen potting .
4.LED spotlight, led wall washer, Broad Area Linear Lights and fluorescent lamp.
Properties before curing
viscosity, mPa±s(25℃ )
Density, g/cm3(25℃ )
A：B = 100：(10±3)
Viscosityafter mixing（mPa±s(25℃ )
Operation time after mixing, min(25℃ )
Curing condition, min,25℃
Properties after curing
Colorless transparent elastomer
Hardness, shore A
Tensile strength, MPa
Shear strength, MPa
Dielectric strength, KV/mm
Volume resistance DC500V, Ωcm
Loss factor (1 MHz)
Dielectric constant (1 MHz)
Service temperature， ℃
- 50 ∽ 200
①All data above were tested under standardized condition.
②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.
③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing.
1.Mixing uniformity in the packing before using.
2.Maxed A, B component as the weighing ratio of 10:1, mixing, and injected to the protection components (or modules) which need potting directly. In order to reduce the bubbles, injected slowly along the walls of the implement..
3.Let the components sit，out of bubble by themselves，heat curing or curing in the room temperature after the bubble disappeared，need about 1-6hours.
4.About potting equipment please contact our Marketing Department
1.It can improve the performance of the hardened by vacuum defoaming for mixed component.
2.After use, please seal the package.
3.The curing speed will be slow in the low temperature, suggest workshop in constant temperature.The temperature is too low will lead curing speed Pianman, the proposed workshop thermostat
4.Once SI2225 contact with sulfur, amine, tin material would be difficult to sclerosis.
Automobile and power source
◆Package and Storage
1.A component 10kg Barrel ; B component 1kg Bottle
2. Other packing can be customized
B component should be keep in cool and ventilative place
Shelf life: 12 months (25℃)
Transport as non-dangerous Article.
◆Safety Operation Material
MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center firstname.lastname@example.org, or call +86-400-882-1323.
All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replace or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.