Thermally Conductive Silicone Potting Compound SI2200 ◆Detailed Product Description SI2200 can be used for all kinds electronic components potting and protecting. It can be heated curing,
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Thermally Conductive Silicone Potting Compound SI2200
◆Detailed Product Description
SI2200 can be used for all kinds electronic components potting and protecting. It can be heated curing, operating time can be adjusted according to temperature.Good fluidity after mixed A and B.
1.Two component and Molding silicone rubber
2.Low speed on stiffness and shrinking
3.Excellent electrical insulation on high temperature and good stability
4.Good property on waterproofing and damp-proofing
5.Excellent adhesion property, curing time longer, the adhesion will be better
For all kinds of electronics encapsulating and potting. Such as Automotive electronics module; Power control module; Solar junction box; Magnetic induction coil. Ceramic electrode; High voltage vacuum circuit breaker.
Properties before curing
White / black viscous liquid
White viscous liquid
specific gravity g/cm3(25℃)
Mixing ratio by weight
A：B = 100：10
Operation time after mixed， min(25℃)
Curing conditions, ℃/hr
25℃/12hrs or 80℃/ 30mins
Properties after curing
White/ Gray/Red elastomer
Hardness, shore A
Dielectric strength, KV/mm
Volume resistivity (DC500V), Ω·cm
Loss factor (1 MHz)
Permittivity (1 MHz)
Service temperature, ℃
- 60 ∽ 260
①All data above were tested under standardized condition.
②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.
③Storage condition has a direct impact to the products’shelf life, Please refer to the instruction for special items’storing.
1.Mixing uniformity in the packing before using.
2.Maxed A, B component as the weighing ratio of 10:1, mixing, and injected to the protection components (or modules) which need potting directly. In order to reduce the bubbles, injected slowly along the walls of the implement..
3.Let the components sit，out of bubble by themselves，heat curing or curing in the room temperature after the bubble disappeared，need about 5-6hours.
4.About potting equipment please contact our Marketing Department
1.It can improve the performance of the hardened by vacuum defoaming for mixed component.
2.After use, please seal the package.
3.The curing speed will be slow in the low temperature, suggest workshop in constant temperature.The temperature is too low will lead curing speed Pianman, the proposed workshop thermostat
4. Once SI2200contact with sulfur, amine, tin material would be difficult to sclerosis.
◆Package and Storage
1.A component 10kg/20kg Barrel B component should be keep in cool and ventilative place
B component 10kg/20kg Bottle Shelf life: 12 months (25℃)
2. Other packing can be customized
◆Safety Operation Material
MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from SEPNA or other distributors, or mail to service center firstname.lastname@example.org, or call +86-400-882-1323.
All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. SEPNA don't make assurance of any other applications outside the specification until SEPNA supply a special written guarantee. SEPNA is only responsible to replace or refund if this product is defective within the warranty period stated above. SEPNA makes it clear that will not be liable of any accidents.