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2 Parts Silicone Gel For Electronics

Addition Type Insulation Silicone Gel SI2709◆Detailed Product DescriptionSI2709A/B is transparent silicone gel, after cured it will be quite elastic material with buffer. It’s used to isolate moisture

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Addition Type Insulation Silicone Gel SI2709

◆Detailed Product Description

SI2709A/B is transparent silicone gel, after cured it will be quite elastic material with buffer. It’s used to isolate moisture and other noxious pollutant from contacting the circuit board, also used to dielectric of high voltage. The other usage is stress relief for protecting circuit and contact device from high temperature and mechanical stress.

Features 

1.1:1, addition type, strong adhesive force

2.Superior elasticity for stress relief

3.Quite low oil penetration after cured, good anti-poisoning

4.Good dielectric in high temperature, protect from high voltage

5.Excellent age resistance and weather resistance

6.Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance

Usage

1.Use in Optical Fiber Splice Closure, waterproof junction box and underwater instrument

2.Widely used in power electronics, ignition module and potting of IGBT

◆Data Table

Properties before curing

Part

2709A

2709B

Component

Polysiloxane

Hydrogen polysiloxane

Appearance

Transparent liquid

Transparent liquid

Viscosity, mPa.s(25℃)

500

500

Density, g/cm3(25℃)

0.99

0.99

Mixture/mass ratio

A:B = 100:100

Viscosity after mixing, mPa.s(25℃)

500

Operation time after mixing, min(25℃)

10 min

Preliminary curing time, min,25℃

30mins

Properties after curin

Appearance

Transparent gel

Penetration degree 1/mm

90

Dielectric strength, KV/mm

25

Volume resistance DC500V, Ω·cm

1.1×1014

Loss factor(1 MHz)

<0.001

Dielectric constant (1 MHz)

2.8

Application temperature, ℃

- 60 ∽ 260

Note:

①All data above were tested under standardized condition.

②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.

③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing.

◆Operation Attention

1.Mix Part A and Part B by 1:1, pour directly into the protection needed component(or module).

2.Still the potted component to let it discharge the bubble. The curing time is about 4-5 hours at room temperature. It also can be heating cured, will need about 30 minutes at 80℃.

◆Notice

1.Vacuum defoamation can provide the property of cured product

2.The Mixed glue should be sealed after using

3.Low temperature will slow the curing speed, advice to heat curing

4.SI2709 will be hard to cure if contact with sulfur, amine or Sn

◆Package and Storage

Package                                   Storage  

Part A: 10KG Bucket                Shipped and stored as normal chemicals

Part B: 10KG Bucket                Shelf life: 12 months(25℃)

◆Safety Operation Material

MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center sepuna@sepuna.cn, or call +86-400-882-1323.

◆Product Warranty

All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replace or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.


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