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Liquid Silicone Gel For Electronics

Addition Type Silicone Gel For Electronic Potting SI2707◆Detailed Product DescriptionSI2707A/B is light blue silicone gel, after cured it will be quite elastic material with buffer.

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Addition Type Silicone Gel For Electronic Potting SI2707

◆Detailed Product Description

SI2707A/B is light blue silicone gel, after cured it will be quite elastic material with buffer. It’s used to isolate moisture and other noxious pollutant from contacting the circuit board, also used to dielectric of high voltage. The other usage is stress relief for protecting circuit and contact device from high temperature and mechanical stress.


1.1:1 addition type

2.Superior elasticity for stress relief

3.Quite low oil penetration after cured, good anti-poisoning

4.Good dielectric in high temperature, protect from high voltage

5.Excellent age resistance and weather resistance

6.Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance


1.Use in Optical Fiber Splice Closure, waterproof junction box and underwater instrument

2.Widely used in power electronics, ignition module and potting of IGBT

◆Data Table

Properties before curing






Hydrogen polysiloxane


Light blue liquid

Transparent liquid

Viscosity, mPa.s(25℃ )



Density,  g/cm3(25℃ )



Mixture/mass ratio

A:B = 100:100

Tensile strength after mixing,cps(25℃ )


Operation time after mixing, min(25℃ )


Curing addition, min,25℃

25℃ /15mins

Properties after curin


Light blue transparent gel

Shore A


Dielectric strength, KV/mm


Volume resistance DC500V, Ω·cm


Loss factor(1 MHz)


Dielectric constant (1 MHz)


Application temperature, ℃

- 60 ∽ 260


①All data above were tested under standardized condition.

②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.

③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing.

◆Operation Attention

1.Mix Part A and Part B by 1:1, pour directly into the protection needed component(or module).

2.Still the potted component to let it discharge the bubble. It can cure in short time, about 20-30mins in room temperature.Use pouring equipment in application.


1.Vacuum defoamation can provide the property of cured product

2.The Mixed glue should be sealed after using

3.Low temperature will slow the curing speed, advice to heat curing

4.SI2707 will be hard to cure if contact with sulfur, amine or Sn

◆Package and Storage

Package                                   Storage  

Part A: 10KG Bucket                Shipped and stored as normal chemicals

Part B: 10KG Bucket                Shelf life: 12 months(25℃)。

◆Safety Operation Material

MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center, or call +86-400-882-1323.

◆Product Warranty

All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replace or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.

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